From crystal growth and slicing in its early stage to the sophisti-cated wafer process, semiconductor manufacturing demands large amount of pure water for photo-masking, circuit-etching and CMP grinding. As the demand for precision increases, integrated circuits have advanced into nano domain, and as a result, the required purity of treatment water is escalating. Currently, the primary requirements for the quality of pure water for a 12'' wafer plant are as follows:
Total Organic Carbon (TOC)＜0.5ppb
Silicon Dioxide ＞0.1ppb
The design of a pure water system shall be taken into consideration of not only the quality, stability for extended operation and simplicity of operation, but also savings on electricity and water consump-tions.